Datasheet

STPS3045C
Characteristics
DocID3510 Rev 9
5/13
Figure 7: Forward voltage drop versus forward
current (maximum values, per diode)
Figure 8: Thermal resistance junction to ambient
versus copper surface under tab
0
10
20
30
40
50
60
70
80
0 5 10 15 20 25 30 35 40
R
th(j-a)
(°C/W)
D²PAK
Epoxy printed board FR4, copper thickness = 35 µm
S
Cu
(cm²)
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