Datasheet

Figure 11. Thermal resistance junction to ambient versus
copper surface under each lead (SMA)
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
SMA
S
(Cu)
(cm²)
Epoxy printed circuit board FR4,copper thickness: 35 µm
Figure 12. Thermal resistance versus lead length (DO-41)
R
th
(°C/W)
0
20
40
60
80
100
120
5 10 15 25
L
leads
(mm)
R
th(j-I)
R
th(j-a)
20
Figure 13. Thermal resistance junction to ambient versus
copper surface under each lead (SMB Flat)
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
S
Cu
(cm²)
R
th(j-a)
(°C/W)
SMB-Flat
Epoxy printed circuit board FR4, e
Cu
= 35 µm
Figure 14. Thermal resistance junction to ambient versus
copper surface under each lead (SMA Flat Notch)
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
S
(Cu)
(cm²)
Epoxy printed circuit board FR4,copper thickness: 35 µm
SMA Flat Notch
STPS2L60
Characteristics (curves)
DS2976 - Rev 8
page 5/15