Datasheet

Figure 5. Relative variation of thermal impedance junction
to ambient versus pulse duration (SMA)
Z / R
th(j-a) th(j-a)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02
t (s)
p
Single pulse
Figure 6. Relative variation of thermal impedance junction
to ambient versus pulse duration (DO-41)
Z / R
th(j-a) th(j-a)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
t (s)
p
Single pulse
Figure 7. Relative variation of thermal impedance junction
to lead versus pulse duration (SMB Flat)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
Single pulse
Z /R
th(j-l) th(j-l)
t (s)
p
epoxy printed circuit board FR4, copper thic
kness:
35 µm
Figure 8. Junction capacitance versus reverse voltage
applied (typical values)
10
100
1000
1 10 100
C(pF)
V (V)
R
F=1MHz
V =30mV
T =25°C
OSC RMS
j
Figure 9. Reverse leakage current versus reverse voltage
applied (typical values)
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
1.E+05
0 10 20 30 40 50 60
I (µA)
R
T =125°C
j
T =150°C
j
T =100°C
j
T =50°C
j
T =25°C
j
T =75°C
j
V
R
(V)
Figure 10. Forward voltage drop versus forward current
0
1
2
3
4
5
6
7
8
9
10
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
I (A)
F
T
j
=25°C
(maximum values)
T
j
=125°C
(Maximum values)
T
j
=125°C
(maximum values)
V (V)
F
T
j
=125°CT
j
=125°C
(typical values)
STPS2L60
Characteristics (curves)
DS2976 - Rev 8
page 4/15