Datasheet

Figure 5. Reverse leakage current versus reverse voltage
applied (typical values)
I (mA)
R
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
0
20
25
V (V)
R
T =150°C
j
T =25°C
j
T =100°C
j
T =125°C
j
5 10 15
Figure 6. Junction capacitance versus reverse voltage
applied (typical values)
C(pF)
10
100
1000
1 10 100
V (V)
R
F=1MHz
V =30mV
T =25°C
OSC RMS
j
Figure 7. Forward voltage drop versus forward current
(high level)
I (A)
F
V (V)
F
T
j
=125°C
(maximum values)
T
j
=125°C
(typical values)
T
j
=25°C
(maximum values)
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
0.1
1.0
10.0
Figure 8. Forward voltage drop versus forward current
(low level)
0.0 0.1 0.2 0.3 0.4 0.5 0.6
0.0
0.5
1.0
1.5
2.0
2.5
3.0
I (A)
F
V (V)
F
T
j
=125°C
(maximum values)
T
j
=125°C
(typical values)
T
j
=25°C
(maximum values)
Figure 9. Forward voltage drop versus forward current
(typical values)
0.0 0.1 0.2 0.3 0.4 0.5 0.6
0.10
1.00
10.00
I (A)
F
V (V)
F
T =25°C
j
T =125°C
j
T =150°C
j
Figure 10. Thermal resistance junction to ambient versus
copper surface under each lead
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
SMB
S
(Cu)
(cm²)
Epoxy p ri nted ci rcuit board FR4, coppe r t hi ckness: 35 µm
STPS2L25
Characteristics (curves)
DS1245 - Rev 7
page 4/12
Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.