Datasheet

STPS2H100 Characteristics
Doc ID 6115 Rev 7 5/10
Figure 17. Thermal resistance junction to ambient versus copper surface under each lead
(SMB flat)
Figure 13. Forward voltage drop versus
forward current (low level)
Figure 14. Forward voltage drop versus
forward current (high level)
I (A)
FM
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
T
j
=25°C
(Maximum values)
T
j
=125°C
(Maximum values)
T
j
=125°C
(Maximum values)
T
j
=125°C
(Typical values)
T
j
=125°C
(Typical values)
V (V)
FM
I (A)
FM
1
10
100
0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8
T
j
=25°C
(Maximum values)
T
j
=125°C
(Maximum values)
T
j
=125°C
(Maximum values)
T
j
=125°C
(Typical values)
T
j
=125°C
(Typical values)
V (V)
FM
Figure 15. Thermal resistance junction to
ambient versus copper surface
under each lead (SMA)
Figure 16. Thermal resistance junction to
ambient versus copper surface
under each lead (SMB)
0
10
20
30
40
50
60
70
80
90
100
110
120
130
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
S (cm²)
CU
SMA
Epoxy printed circuit board FR4,
Copper thickness = 35 µm
0
10
20
30
40
50
60
70
80
90
100
110
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
S (cm²)
CU
SMB
Epoxy printed circuit board FR4,
Copper thickness = 35 µm
0
10
20
30
40
50
60
70
80
90
100
110
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
S (cm²)
CU
SMB flat
Epoxy printed circuit board FR4,
Copper thickness = 35 µm