Datasheet

Characteristics STPS2H100
4/10 Doc ID 6115 Rev 7
Figure 7. Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMB)
Figure 8. Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMB flat)
0
1
2
3
4
5
6
7
8
9
10
1.E-03 1.E-02 1.E-01 1.E+00
I (A)
M
IM
t
δ=0.5
t(s)
T =125°C
a
T =25°C
a
T =75°C
a
SMB
0
5
10
15
20
25
30
1.E-03 1.E-02 1.E-01 1.E+00
I (A)
M
IM
t
δ=0.5
t(s)
T =125°C
L
T =25°C
L
T =75°C
L
SMB flat
Figure 9. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMA / SMB)
Figure 10. Relative variation of thermal
impedance junction to lead
versus pulse duration (SMB flat)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z/R
th(j-a) th(j-a)
T
δ
=tp/T
tp
t (s)
p
Single pulse
SMA
SMB
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
SMB flat
(non exposed pad)
Z/R
th(j-l) th(j-l)
t (s)
p
Single pulse
Figure 11. Reverse leakage current versus
reverse voltage applied
(typical values)
Figure 12. Junction capacitance versus
reverse voltage applied
(typical values)
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
0 20406080100
T
j
=150°C
T
j
=125°C
T
j
=25°C
T
j
=100°C
T
j
=75°C
T
j
=50°C
V (V)
R
I (µA)
R
10
100
1 10 100
C(pF)
V (V)
R
F=1MHz
V =30mV
T =25°C
OSC RMS
j