Datasheet

Figure 11. Thermal resistance junction to ambient versus
copper surface under each lead (SMA Flat Notch)
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
S
(Cu)
(cm²)
Epoxy printed circuit board FR4, copper thickness: 35 µm
SMA Flat Notch
Figure 12. Thermal resistance versus lead length (DO-15)
R (°C/W)
th
0
20
40
60
80
100
120
5 10 15 20 25
R
th(j-a)
R
th(j-I)
L (mm)
leads
STPS2150
Characteristics (curves)
DS3282 - Rev 8
page 5/13