Datasheet

Characteristics STPS1L60
6/10 Doc ID 7504 Rev 8
Figure 19. Thermal resistance junction to ambient versus copper surface under tab (STmite flat)
Figure 17. Thermal resistance junction to
ambient versus copper surface
under each lead (SMA)
Figure 18. Thermal resistance versus lead
length (DO-41)
0
20
40
60
80
100
120
140
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SMA
S
cu
(cm²)
R
th(j-a)
(°C/W)
Epoxy printed circuit board FR4
copper thickness= 35 µm
0
20
40
60
80
100
120
5101520
L
leads
(mm)
25
R
th
(°C/W)
DO-41
R
th(j-a)
R
th(j-l)
0
25
50
75
100
125
150
175
200
225
250
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
STmite flat
R
th(j-a)
(°C/W)
S
cu
(cm²)
Epoxy printed circuit board FR4
copper thickness= 35 µm