Datasheet

Characteristics STPS1L60
4/10 Doc ID 7504 Rev 8
Figure 7. Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMA)
Figure 8. Non repetitive surge peak forward
current versus overload duration
(maximum values) (DO-41)
0
1
2
3
4
5
6
7
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
T
a
= 25 °C
T
a
= 75 °C
T
a
= 125 °C
SMA
I
M
t
δ = 0.5
I
M
(A)
t(s)
0
2
3
4
5
6
7
8
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
I
M
(A)
I
M
t
δ
= 0.5
1
DO-41
T
a
= 25 °C
T
a
= 75 °C
T
a
= 125 °C
t(s)
Figure 9. Non repetitive surge peak forward
current versus overload duration
(maximum values) (STmite flat)
Figure 10. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMA)
0
2
4
6
8
10
12
14
16
18
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
T
c
= 25 °C
T
c
= 75 °C
T
c
= 125 °C
t(s)
I
M
t
δ = 0.5
I
M
(A)
STmite flat
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z
th(j-a)
/R
th(j-a)
t
p
(s)
Single pulse
SMA
Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout
Figure 11. Relative variation of thermal
impedance junction to ambient
versus pulse duration (DO-41)
Figure 12. Relative variation of thermal
impedance junction to ambient
versus pulse duration (STmite flat)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Single pulse
DO-41
Z
th(j-a)
/R
th(j-a)
t
p
(s)
Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z
th(j-a)
/R
th(j-a)
Single pulse
t
p
(s)
STmite flat
Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout