Datasheet

Characteristics STPS1L40
6/11 Doc ID 5507 Rev 6
Figure 19. Thermal resistance junction to ambient versus copper surface under tab (STmite flat)
Figure 17. Thermal resistance junction to
ambient versus copper surface
under each lead (SMA)
Figure 18. Thermal resistance junction to
ambient versus copper surface
under each lead (SMB)
0
20
40
60
80
100
120
140
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R
th(j-a)
(°C/W)
S
cu
(cm²)
SMA
Epoxy printed circuit board, FR4
copper thickness = 35 µm
0
20
40
60
80
100
120
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
S
cu
(cm²)
R
th(j-a)
(°C/W)
SMB
Epoxy printed circuit board, FR4
copper thickness = 35 µm
0
25
50
75
100
125
150
175
200
225
250
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R
th(j-a)
(°C/W)
S
cu
(cm²)
STmite flat
Epoxy printed circuit board, FR4
copper thickness = 35 µm