Datasheet

Characteristics STPS1L40
4/11 Doc ID 5507 Rev 6
Figure 7. Non repetitive surge peak forward
current versus overload duration
(maximum values, SMA)
Figure 8. Non repetitive surge peak forward
current versus overload duration
(maximum values, SMB)
0
1
2
3
4
5
6
7
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
I
M
t
δ = 0.5
t(s)
I
M
(A)
SMA
T
a
= 25 °C
T
a
= 75 °C
T
a
= 125 °C
0
1
2
3
4
5
6
7
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
I
M
(A)
I
M
t
δ
= 0.5
T
a
= 25 °C
T
a
= 75 °C
T
a
= 125 °C
SMB
Figure 9. Non repetitive surge peak forward
current versus overload duration
(maximum values, STmite flat)
Figure 10. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMA)
0
2
4
6
8
10
12
14
16
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
I
M
(A)
I
M
t
δ = 0.5
STmite flat
t(s)
T
c
= 25 °C
T
c
= 75 °C
T
c
= 125 °C
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Single pulse
SMA
Z
th(j-a)
/R
th(j-a)
t
p
(s)
Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout
Figure 11. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMB)
Figure 12. Relative variation of thermal
impedance junction to ambient
versus pulse duration (STmite flat)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z
th(j-a)
/R
th(j-a)
Single pulse
SMB
t
p
(s)
Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z
th(j-a)
/R
th(j-a)
Single pulse
STmite flat
t
p
(s)
Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout