Datasheet

Figure 11. Thermal resistance junction to ambient versus
copper surface under each lead (SMA)
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
SMA
S
(Cu)
(cm²)
Epoxy printed circuit board FR4, copper thic kness: 35 µm
Figure 12. Thermal resistance junction to ambient versus
copper surface under each lead (SMA Flat Notch)
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
S
(Cu)
(cm²)
Epoxy printed circuit board FR4, copper thic kness: 35 µm
SMA Flat Notch
STPS1L30
Characteristics (curves)
DS1243 - Rev 8
page 5/15