STPS1L30 Datasheet 30 V, 1 A low drop power Schottky rectifier Features • • • • Very low forward voltage drop for less power dissipation Surface mount miniature packages Avalanche rated ECOPACK2 compliant Applications • • • • • Cordless appliance SSD Battery charger Telecom power DC / DC converter Description Schottky rectifiers designed for high frequency miniature switched mode power supplies such as adaptors and on board DC/DC converters.
STPS1L30 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 30 V IF(RMS) Forward rms current 10 A 1 A IF(AV) Average forward current, δ = 0.
STPS1L30 Characteristics (curves) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode 1.1 Characteristics (curves) Figure 2. Average forward current versus ambient temperature (δ = 0.5) Figure 1. Average forward power dissipation versus average forward current PF(AV)(W) δ = 0.05 0.45 IF(AV)(A) 6 0.50 δ = 0.1 δ = 0.2 δ = 0.
STPS1L30 Characteristics (curves) Figure 5. Relative variation of thermal impedance junction to ambient versus pulse duration (SMA) Figure 6. Reverse leakage current versus reverse voltage applied (typical values) IR(mA) Zth(j-a)/ Rth(j-a) 1.E+2 1.00 T j =150°C SMA T j =125°C 1.E+1 T j =100°C 1.E+0 0.10 1.E-1 T j =25°C Single pulse 1.E-2 t p (s) 1.E-03 1.E-02 1.E-01 1.E+00 VR (V) 1.E-3 0.01 1.E+01 1.E+02 0 1.E+03 Figure 7.
STPS1L30 Characteristics (curves) Figure 11. Thermal resistance junction to ambient versus copper surface under each lead (SMA) Figure 12. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat Notch) Rth(j-a) (°C/W) Rth(j-a) (°C/W) 200 200 Epoxy printed circuit board FR4, copper thickness: 35 µm Epoxy printed circuit board FR4, copper thickness: 35 µm SMA SMA Flat Notch 150 150 100 100 50 50 S(Cu)(cm²) S(Cu)(cm²) 0 0 0.0 0.5 DS1243 - Rev 8 1.0 1.5 2.
STPS1L30 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
STPS1L30 SMA package information 2.1 SMA package information • • Epoxy meets UL94, V0 Cooling method : by conduction (C) Figure 13. SMA package outline E1 D E A1 C A2 L b Table 4. SMA package mechanical data Dimensions Ref. DS1243 - Rev 8 Millimeters Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 4.80 5.35 0.188 0.211 E1 3.95 4.60 0.
STPS1L30 SMA package information Figure 14. SMA recommended footprint in mm (inches) 1.4 2.63 1.4 (0.055) (0.104) (0.055) 1.64 (0.065) 5.43 (0.
STPS1L30 SMA Flat Notch package information 2.2 SMA Flat Notch package information • • • Epoxy meets UL94, V0 Cooling method: by conduction (C) Band indicates cathode Figure 15. SMA Flat Notch package outline Table 5. SMA Flat Notch package mechanical data Dimensions Ref. Millimeters Min. A1 0.90 A1 Max. Min. 1.10 0.035 0.05 Typ. Max. 0.044 0.002 b 1.25 1.65 0.049 0.065 C 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 5.00 5.35 0.196 0.211 E1 3.95 4.60 0.155 0.
STPS1L30 SMA Flat Notch package information Figure 16. SMA Flat Notch recommended footprint in mm (inches) 1.20 (0.047) 3.12 1.20 (0.123) (0.047) 1.52 (0.060) 5.52 (0.
STPS1L30 SMB package information 2.3 SMB package information • • Epoxy meets UL94, V0 Lead-free package Figure 17. SMB package outline E1 D E A1 C A2 L b Table 6. SMB package mechanical data Dimensions Millimeters Ref. DS1243 - Rev 8 Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.10 5.60 0.200 0.221 E1 4.05 4.60 0.159 0.182 L 0.
STPS1L30 SMB package information Figure 18. SMB recommended footprint 1.62 2.60 1.62 (0.064) (0.102) (0.064) 2.18 (0.086) 5.84 (0.
STPS1L30 Ordering Information 3 Ordering Information Table 7. Ordering information DS1243 - Rev 8 Order code Marking Package Weight Base qty. Delivery mode STPS1L30A GB3 SMA 0.068 g 5000 Tape and reel STPS1L30AFN A13 SMA Flat Notch 0.039 g 10 000 Tape and reel STPS1L30U G23 SMB 0.
STPS1L30 Revision history Table 8. Document revision history DS1243 - Rev 8 Date Version Changes Jul-2003 5A Aug-2004 6 SMA package dimensions update. Reference A1 max changed from 2.70 mm (0.106 inc.) to 2.03 mm (0.080 inc). 17-Sep-2018 7 Updated Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) and Figure 3. Normalized avalanche power derating versus junction temperature (Tj = 125 °C). 26-Sep-2019 8 Added Section 2.2 SMA Flat Notch package information.
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