Datasheet

STPS1L30
3/7
Figure 5: Non repetitive surge peak forward
current versus overload duration (maximum
values) (SMA)
Figure 6: Non repetitive surge peak forward
current versus overload duration (maximum
values) (SMB)
Figure 7: Relative variation of thermal
impedance junction to ambient versus pulse
duration (epoxy printed circuit board,
e(Cu)=35µm, recommended pad layout) (SMA)
Figure 8: Relative variation of thermal
impedance junction to ambient versus pulse
duration (epoxy printed circuit board,
e(Cu)=35µm, recommended pad layout) (SMB)
Figure 9: Reverse leakage current versus
reverse voltage applied (typical values)
Figure 10: Junction capacitance versus
reverse voltage applied (typical values)
I (A)
M
1E-3
1E-2 1E-1
1E+0
0
2
4
6
8
10
I M
t
δ=0.5
t(s)
T =25°C
a
T =50°C
a
T =100°C
a
1E-3
1E-2 1E-1 1E+0
0
2
4
6
8
10
I (A)
M
IM
t
δ=0.5
t(s)
T =25°C
a
T =50°C
a
T =100°C
a
1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
0.0
0.2
0.4
0.6
0.8
1.0
Z/R
th(j-c) th(j-c)
T
δ
=tp/T
tp
t (s)
p
δ = 0.5
δ = 0.2
δ = 0.1
Single pulse
1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
0.0
0.2
0.4
0.6
0.8
1.0
Z/R
th(j-c) th(j-c)
T
δ
=tp/T
tp
t (s)
p
δ
= 0.5
δ
= 0.2
δ
= 0.1
Single pulse
0 5 10 15 20 25 30
1E-3
1E-2
1E-1
1E+0
1E+1
1E+2
I (mA)
R
V (V)
R
T =125°C
j
T =150°C
j
T =100°C
j
T =25°C
j
12 5102030
10
100
500
C(pF)
V (V)
R
F=1MHz
T =25°C
j