Datasheet

Figure 7. Junction capacitance versus reverse voltage
applied (typical values)
C(pF)
10
100
1 1 0 100
F=1 MHz
V
OSC
=30 mV
RMS
T
j
=25 °C
V (V)
R
Figure 8. Forward voltage drop versus forward current
(maximum values)
I (A)
FM
0.01
0.10
1.00
10.00
100.00
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
T
j
=25 °C
T
j
=125 °C
V (V)
FM
Figure 9. Thermal resistance junction to ambient versus
copper surface under each lead (SMB)
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
SMB
S
(Cu)
(cm²)
Epoxy printed ci rcui t board FR4, coppe r t hickness: 35 µm
Figure 10. Thermal resistance junction to ambient versus
copper surface under each lead (SMA)
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
SMA
S
(Cu)
(cm²)
Epoxy printed circuit board FR4, copper thickness: 35 µm
STPS1H100-Y
Characteristics (curves)
DS6946 - Rev 2
page 4/11