Datasheet

Figure 7. Relative variation of thermal impedance junction
to ambient versus pulse duration
0.01
0.10
1.00
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z /R
th(j-a) th(j-a)
Single pulse
SMA Flat
SMA Flat Notch
t (s)
p
Figure 8. Reverse leakage current versus reverse voltage
applied (typical values)
I (µA)
R
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
0 1 0 20 3 0 40 50 60 70 80 90 100
T
j
=125 °C
T
j
=25 °C
V (V)
R
Figure 9. Forward voltage drop versus forward current
(maximum values)
I (A)
FM
0.01
0.10
1.00
10.00
100.00
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
T
j
=25 °C
T
j
=125 °C
V (V)
FM
Figure 10. Thermal resistance junction to ambient versus
copper surface under each lead (SMB)
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
SMB
S
(Cu)
(cm²)
Epoxy p rinted ci rcui t board FR4, coppe r t hickness: 35 µm
Figure 11. Thermal resistance junction to ambient versus
copper surface under each lead
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
SMA
S
(Cu)
(cm²)
Epoxy printed circuit board FR4,copper thickness: 35 µm
Figure 12. Thermal resistance junction to ambient versus
copper surface under each lead
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
S
(Cu)
(cm²)
Epoxy printed circuit board FR4,copper thickness: 35 µm
SMA Flat Notch
SMA Flat
STPS1H100
Characteristics (curves)
DS1228 - Rev 8
page 4/15