Datasheet

Characteristics
STPS1545
4/13
DocID3504 Rev 7
0
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40
50
60
70
80
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S
Cu
(cm²)
R
th(j-a)
(°C/W)
Epoxy printed board FR4, e
CU
= 35 µm
Figure 7: Junction capacitance versus reverse
voltage applied (typical values)
Figure 8: Forward voltage drop versus forward
current (maximum values)
Figure 9: Thermal resistance junction to ambient versus copper surface under tab for D²PAK
(typical values)
100
200
500
1000
2000
C(pF)
V
R
(V)
F = 1 MHz
V
OSC
= 30 mV
RMS
T
j
= 25 °C
1 2 5 10 20 50