Datasheet

STPS1150 Characteristics
Doc ID 9472 Rev 5 5/11
Figure 13. Reverse leakage current versus
reverse voltage applied (typical
values)
Figure 14. Junction capacitance versus
reverse voltage applied (typical
values)
I (µA)
R
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
0 25 50 75 100 125 150
T =125°C
j
T =150°C
j
T =100°C
j
T =50°C
j
T =25°C
j
T =75°C
j
V (V)
R
C(pF)
1
10
100
1 10 100 1000
F=1MHz
V =30mV
T =25°C
OSC RMS
j
V (V)
R
Figure 15. Forward voltage drop versus
forward current (all packages)
Figure 16. Thermal resistance junction to
ambient versus copper surface
under tab (STmite)
I (A)
FM
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
V (V)
FM
T =125°C
(maximum values)
j
T =125°C
(typical values)
j
T =25°C
(maximum values)
j
0
25
50
75
100
125
150
175
200
225
250
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
STmite
R (°C/W)
th(j-a)
S (cm²)
Cu
Epoxy printed circuit board,
copper thickness = 35 µm
Figure 17. Thermal resistance junction to
ambient versus copper surface
under tab (STmite flat)
Figure 18. Thermal resistance junction to
ambient versus copper surface
under each lead (SMA)
0
25
50
75
100
125
150
175
200
225
250
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
STmite flat
R (°C/W)
th(j-a)
S (cm²)
Cu
Epoxy printed circuit board,
copper thickness = 35 µm
R (°C/W)
th(j-a)
0
10
20
30
40
50
60
70
80
90
100
110
120
130
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
S (cm²)
Cu
Epoxy printed circuit board,
copper thickness = 35 µm