Datasheet

Characteristics STPS1045DEE
4/8 Doc ID 023252 Rev 1
Figure 7. Forward voltage drop versus
forward current
Figure 8. Thermal resistance junction to
ambient versus copper surface
under tab
I
FM
(A)
0.1
1.0
10.0
100.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
V
FM
(V)
T
j
=25 °C
(Maximum values)
T
j
=125 °C
(Maximum values)
T
j
=125 °C
(Typical values)
R
th(j-a)
(°C/W)
0
50
100
150
200
250
012345678910
PowerFLAT (3.3x3.3)
S
Cu
(cm²)
epoxy printed board FR4, copper thickness
=35µm