Datasheet

STPS0520Z
3/5
0.0 0.1 0.2 0.3 0.4 0.5 0.6
0.00
0.05
0.10
0.15
0.20
0.25
IF(av) (A)
PF(av)(W)
T
δ
=tp/T
tp
δ = 0.05
δ = 0.1
δ = 0.2
δ = 0.5
δ = 1
Fig. 1: Average forward power dissipation versus
average forward current
0 25 50 75 100 125
0.0
0.1
0.2
0.3
0.4
0.5
0.6
Tamb(°C)
IF(av)(A)
T
δ
=tp/T
tp
Fig. 2: Average forward current versus ambient
temperature (δ = 0.5)
1E-3 1E-2 1E-1 1E+0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
t(s)
IM(A)
Ta=25°C
Ta=50°C
Ta=75°C
IM
t
δ=0.5
Fig. 3: Non repetitive surge peak forward current
versus overload duration (maximum values).
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2
1E-3
1E-2
1E-1
1E+0
tp(s)
Zth(j-a)/Rth(j-a)
δ = 0.5
δ = 0.2
δ = 0.1
Single pulse
T
δ
=tp/T
tp
Fig. 4: Relative variation of thermal impedance
junction to ambient versus pulse duration (Epoxy
printed circuit board FR4 with recommended pad
layout).
0 2 4 6 8 101214161820
1E-3
1E-2
1E-1
1E+0
1E+1
2E+1
VR(V)
IR(mA)
Tj=70°C
Tj=25°C
Tj=100°C
Tj=125°C
Fig. 5: Reverse leakage current versus reverse
voltage applied (typical values).
0 25 50 75 100 125
1E-1
1E+0
1E+1
1E+2
1E+3
Tj(°C)
IR[Tj] / IR[Tj=25°C]
VR=VRRM
Fig. 6: Relative variation of reverse leakage cur-
rent versus junction temperature (typical values).