Datasheet

DocID14771 Rev 15 101/121
STM8S105x4/6 Package information
107
11.4 UFQFPN32 package information
Figure 56. UFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat
package outline
1. Drawing is not to scale.
2. All leads/pads should be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and
solder this backside pad to PCB ground.
4. Dimensions are in millimeters.
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