Datasheet

STM8S105xx
Revision history
Date Revision Changes
characteristics(1)" and removed Table 57: Junction temperature range.
Updated Figure 52: "STM8S105xx access line ordering information scheme".
10-Jun-
2009
8 Document status changed from “preliminary data” to “datasheet”.
Standardized name of the VFQFPN package.
Removed ‘wpu’ from I2C pins in Section 8: "Pinout and pin description"
21-Apr-
2010
9 Added UFQFPN32 package silhouette to the title page.
Section 3: "Features": added unique ID.
Section 7.4: "Flash program and data EEPROM memory": updated bit
positions for TIM2 and TIM3.
Section 7.9: "Beeper": added information about availability of the beeper
output port through option bit AFR7.
Section 7.13: "Analog-to-digital converter (ADC1)": added a note concerning
additional AIN12 analog input.
Section 8.1: "STM8S105 pinouts and pin description": added UFQFPN32
package details; updated default alternate function of PB2/AIN2[TIM1_CH3N]
pin in the "Pin description for STM8S105 microcontrollers" table.
Section 11: "Option bytes": added description of STM8L bootloader option
bytes to the option byte description table.
Added Section 4: "Introduction"
Section 7.10: "TIM1 - 16-bit advanced control timer": added introductory text;
removed low power dissipation condition for T
A
, replaced "C
EXT
" by "VCAP",
and added ESR and ESL data in table "general operating conditions".
Section 13.3.2.4: "Total current consumption in halt mode": replaced max
value of I
DD(H)
at 85 °C from 20 µA to 25 µA for the condition "Flash in
powerdown mode, HSI clock after wakeup in the table "total current
consumption in halt mode at V
DD
= 5 V.
Section 13.3.2.5: "Low power mode wakeup times": added first condition (0 to
16 MHz) for the t
WU(WFI)
parameter in the table "wakeup times".
Section 13.3.4: "Internal clock sources and timing characteristics": In the table
"HSI oscillator characteristics", replaced min and max values of "ACC
HSI
factory calibrated parameter" and removed footnote 4 concerning further
characterization of results.
Section 13.3.12.1: "Functional EMS (electromagnetic susceptibility)": IEC
1000 replaced with IEC 61000.
Section 13.3.12.2: "Designing hardened software to avoid noise problems":
IEC 1000 replaced with IEC 61000.
Section 13.3.12.3: "Electromagnetic interference (EMI)": SAE J 1752/3
replaced with IEC61967-2.
Section 7.7: "Watchdog timers": Replaced the thermal resistance junction
ambient temperature of LQFP32 7X7 mm from 59 °C to 60 °C in the thermal
characteristics table.
Added Section 6: "Block diagram".
Added Section 17: "STM8S105 FASTROM microcontroller option list".
21-Sep-
2010
10 Table 5: "Legend/abbreviations for pinout tables ": updated "reset state";
removed "HS", (T), and "[ ]".
Table 6: "Pin description for STM8S105 microcontrollers": added footnotes to
the PF4 and PD1 pins.
Table 8: "I/O port hardware register map": changed reset status of Px_IDR
from 0x00 to 0xXX.
Table 9: "General hardware register map"
: Standardized all address and reset
state values; updated the reset state values of the RST_SR, CLK_SWCR,
CLK_HSITRIMR, CLK_SWIMCCR, IWDG_KR, UART2_DR, and ADC_DRx
DocID14771 Rev 13 97/99