Datasheet

Package information
STM8S105xx
11.4 32-lead UFQFPN package mechanical data
Figure 50: 32-lead, ultra-thin, fine pitch quad flat no-lead package (5 x 5)
1. Drawing is not to scale.
2. All leads/pads should be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is
recommended to connect and solder this backside pad to PCB ground.
4. Dimensions are in millimeters.
Table 55: 32-lead ultra-thin fine pitch quad flat no-lead package mechanical data
Dim. mm inches
(1)
Min Typ Max Min Typ Max
A 0.500 0.550 0.600 0.0197 0.0217 0.0236
A1 0 0.020 0.050 0.0008 0.0020
A3 0.200 0.0079
b 0.180 0.250 0.300 0.0071 0.0098 0.0118
D 4.900 5.000 5.100 0.1909 0.1969 0.2028
D2 3.200 3.450 3.700 0.1260 0.1457
E 4.900 5.000 5.100 0.1909 0.1969 0.2028
84/99 DocID14771 Rev 13