Datasheet

Package information STM8S003F3 STM8S003K3
92/103 DS7147 Rev 10
Figure 48. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch,
package footprint
1. Dimensions are expressed in millimeters.
Device marking for TSSOP20
The following figure gives an example of topside marking orientation versus pin 1 identifier
location. Other optional marking or inset/upset marks, which identify the parts throughout
supply chain operations, are not indicated below.
Figure 49. TSSOP20 marking example (package top view)
1. Parts marked as "ES", "E" or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
Samples to run qualification activity.
YA_FP_V1
7.10 4.40
0.25
0.25
6.25
1.35
0.40
0.65
1.35
1
20 11
10
MS37768V1
Product
identification
(1)
Pin 1 identifier
Revision code
Date code
YWW
R
Standard ST logo
8S003F3P6