Datasheet

DS7147 Rev 10 91/103

STM8S003F3 STM8S003K3 Package information

10.2 TSSOP20 package information

Figure 47. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch,

package outline

1. Drawing is not to scale.

Table 53. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch,

package mechanical data

Symbol

millimeters inches

(1)

1. Values in inches are converted from mm and rounded to four decimal digits.

Min. Typ. Max. Min. Typ. Max.

A - - 1.200 - - 0.0472

A1 0.050 - 0.150 0.0020 - 0.0059

A2 0.800 1.000 1.050 0.0315 0.0394 0.0413

b 0.190 - 0.300 0.0075 - 0.0118

c 0.090 - 0.200 0.0035 - 0.0079

(2)

2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs

shall not exceed 0.15mm per side.

6.400 6.500 6.600 0.2520 0.2559 0.2598

E 6.200 6.400 6.600 0.2441 0.2520 0.2598

(3)

3. Dimension "E1" does not include interlead Flash or protrusions. Interlead Flash or protrusions shall not

exceed 0.25mm per side.

4.300 4.400 4.500 0.1693 0.1732 0.1772

e - 0.650 - - 0.0256 -

L 0.450 0.600 0.750 0.0177 0.0236 0.0295

L1 - 1.000 - - 0.0394 -

k 0° - 8° 0° - 8°

aaa - - 0.100 - - 0.0039

YA_ME_V3

EE1

aaa

SEATING

PLANE

GAUGE PLANE

0.25 mm

PIN 1

IDENTIFICATION