Datasheet

Package information STM8S001J3
78/84 DocID030584 Rev 2
Figure 39. SO8N – 8-lead 4.9 x 6 mm, plastic small outline, 150 mils body width,
marking example
1. Parts marked as ES or E or accompanied by an Engineering Sample notification letter are not yet qualified
and therefore not approved for use in production. ST is not responsible for any consequences resulting
from such use. In no event will ST be liable for the customer using any of these engineering samples in
production. ST's Quality department must be contacted prior to any decision to use these engineering
samples to run a qualification activity.
10.2 Thermal characteristics
The maximum chip junction temperature (T
Jmax
) must never exceed the values given in
Table 17: General operating conditions.
The maximum chip-junction temperature, T
Jmax
, in degrees Celsius, may be calculated
using the following equation:
T
Jmax
= T
Amax
+ (P
Dmax
x Θ
JA
)
Where:
T
Amax
is the maximum ambient temperature in ° C
•Θ
JA
is the package junction-to-ambient thermal resistance in ° C/W
P
Dmax
is the sum of P
INTmax
and P
I/Omax
(P
Dmax
= P
INTmax
+ P
I/Omax
)
P
INTmax
is the product of I
DD
and
V
DD
, expressed in Watts. This is the maximum chip
internal power.
P
I/Omax
represents the maximum power dissipation on output pins, where:
P
I/Omax
=
Σ (V
OL
*I
OL
) + Σ((V
DD
-V
OH)
*I
OH
), and taking account of the actual V
OL
/I
OL
and
V
OH
/I
OH
of the I/Os at low and high level in the application.
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