Datasheet
DS11585 Rev 9 259/272
STM32L496xx Package information
268
7.5 WLCSP100 package information
Figure 76.WLCSP – 100 ball, 4.618 x 4.142 mm, 0.4 mm pitch wafer level chip scale
package outline
1. Drawing is not to scale.
2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
4. Bump position designation per JESD 95-1, SPP-010.
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