Datasheet

DocID027096 Rev 2 11/137
STM32L073xx Description
36
2.1 Device overview
Table 2. Ultra-low-power STM32L073xxx device features and peripheral counts
Peripheral
STM32L073
V8
STM32L073
CB
STM32L073
VB
STM32L073
RB
STM32L073
CZ
STM32L073
VZ
STM32L073
RZ
Flash (Kbytes) 64 Kbytes 128 Kbytes 192 Kbytes
Data EEPROM (Kbytes) 3 Kbytes 6 Kbytes
RAM (Kbytes) 20 Kbytes
Timers
General-
purpose
4
Basic 2
LPTIMER 1
RTC/SYSTICK/IWDG/WWDG 1/1/1/1
Communicat
ion
interfaces
SPI/(I2S) 2/(1)
I
2
C 3
USART 4
LPUART 1
USB/
(VDD_USB)
1/(1)
GPIOs 84 37 84 51
(1)
37 84 51
(1)
Clocks:
HSE/LSE/HSI/MSI/LSI
1/1/1/1/1
12-bit synchronized ADC
Number of channels
1
16
1
10
1
16
(1)
1
10
1
16
(1)
12-bit DAC
Number of channels
2
2
LCD
COM x SEG
1
4x52 or
8x48
1
4x18
1
4x52 or
8x48
1
4x32 or
8x28
(1)
1
4x18
1
4x52 or 8x48
1
4x32 or
8x28
(1)
Comparators 2
Capacitive sensing
channels
24 17 24 24
(1)
17 24 24
(1)
Max. CPU frequency 32 MHz
Operating voltage 1.8 V to 3.6 V (down to 1.65 V at power-down) with BOR option 1.65 to 3.6 V without BOR option
Operating temperatures
Ambient temperature: –40 to +125 °C
Junction temperature: –40 to +130 °C
Packages
LQFP100
UFBGA100
LQFP48
LQFP100
UFBGA100
LQFP64,
TFBGA64
LQFP48
LQFP100
UFBGA100
LQFP64,
TFBGA64
1. TFBGA64 has one GPIO, one ADC input, one capacitive sensing channel and one COMxSEG (4x31 or 8x27) less than
LQFP64.
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