Datasheet

DS10668 Rev 6 113/126
STM32L031x4/6 Package information
120
Figure 50. WLCSP25 - 2.097 x 2.493 mm, 0.400 mm pitch wafer level chip scale
recommended footprint
aaa - - 0.100 - - 0.0039
bbb - - 0.100 - - 0.0039
ccc - - 0.100 - - 0.0039
ddd - - 0.050 - - 0.0020
eee - - 0.050 - - 0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Back side coating.
3. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
Table 74. WLCSP25 - 2.097 x 2.493 mm, 0.400 mm pitch wafer level chip scale
mechanical data (continued)
Symbol
Milimeters Inches
(1)
Min Typ Max Min Typ Max
Table 75. WLCSP25 recommended PCB design rules
Dimension Recommended values
Pitch 0.4 mm
Dpad
260 µm max. (circular)
220 µm recommended
Dsm 300 µm min. (for 260 µm diameter pad)
PCB pad design Non-solder mask defined via underbump allowed
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