Datasheet

Package information STM32L011x3/4
100/119 DocID027973 Rev 5
7.3 WLCSP25 package information
Figure 38. WLCSP25 - 25-ball, 2.133 x 2.070 mm, 0.4 mm pitch wafer level chip scale
package outline
1. Drawing is not to scale.
Table 69. WLCSP25 - 25-ball, 2.133 x 2.070 mm, 0.4 mm pitch wafer level chip scale
package mechanical data
Symbol
millimeters inches
(1)
Min Typ Max Min Typ Max
A 0.525 0.555 0.585 0.0207 0.0219 0.0230
A1 - 0.175 - - 0.0069 -
A2 - 0.380 - - 0.0150 -
A3
(2)
- 0.025 - - 0.0010 -
b
(3)
0.220 0.250 0.280 0.0087 0.0098 0.0110
D 2.098 2.133 2.168 0.0826 0.0840 0.0854
E 2.035 2.070 2.105 0.0801 0.0815 0.0829
e - 0.400 - - 0.0157 -
e1 - 1.600 - - 0.0630 -
e2 - 1.600 - - 0.0630 -
F - 0.2665 - - 0.0105 -
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