Datasheet

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STM32L011x3/4 Description
32
2.1 Device overview
Table 2. Ultra-low-power STM32L011x3/x4 device features and peripheral counts
Peripheral
STM32
L011D3
STM32
L011F3
STM32
L011E3
STM32
L011G3
STM32
L011K3
STM32
L011D4
STM32
L011F4
STM32
L011E4
STM32
L011G4
STM32
L011K4
Flash (Kbytes) 816
Data EEPROM (bytes) 512
RAM (Kbytes) 2
Timers
General-
purpose
2
LPTIM 1
RTC/SYSTICK/IWDG/
WWDG
1/1/1/1
Communi-
cation
interfaces
SPI 1
I
2
C 1
USART 1
LPUART 1
GPIOs 11 16 21 24 26/28
(1)
11 16 21 24 26/28
(1)
Clocks:
HSE
(2)
/LSE/HSI/MSI/LSI
1/1/1/1/1
12b synchronized ADC
Number of channels
1
4
1
7/9
(3)
1
10
1
4
1
7/9
(3)
1
10
Comparators 2
Max. CPU frequency 32 MHz
Operating voltage
1.8 V to 3.6 V (down to 1.65 V at power-down) with BOR option
1.65 V to 3.6 V without BOR option
Operating
temperatures
Ambient temperature: –40 to +125 °C
Junction temperature: –40 to +130 °C
Packages
TSSOP
14
TSSOP/
UFQFPN
20
WLCSP
25
UFQFPN
28
LQFP/
UFQFPN
32
TSSOP
14
TSSOP/
UFQFPN
20
WLCSP
25
UFQFPN
28
LQFP/,
UFQFPN
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1. The devices feature 26 and 28 GPIOs on LQFP32 and UFQFPN32, respectively.
2. HSE available only as external clock input (HSE bypass).
3. The devices feature 7 and 9 ADC channels on UFQFPN20 and TSSOP20, respectively.
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