Datasheet

ManualsBrandsST ManualsEmbedded Processors & ControllersMicrocontroller 32bit 8KB TSSOP

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DocID027973 Rev 5 101/119

STM32L011x3/4 Package information

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Figure 39. WLCSP25 - 25-ball, 2.133 x 2.070 mm, 0.4 mm pitch wafer level chip scale

package recommended footprint

G - 0.235 - - 0.0093 -

aaa - - 0.100 - - 0.0039

bbb - - 0.100 - - 0.0039

ccc - - 0.100 - - 0.0039

ddd - - 0.050 - - 0.0020

eee - - 0.050 - - 0.0020

1. Values in inches are converted from mm and rounded to 4 decimal digits.

2. Back side coating.

3. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

Table 70. WLCSP25 recommended PCB design rules (0.4 mm pitch)

Dimension Recommended values

Pitch 0.4 mm

Dpad 0.225 mm

Dsm

0.290 mm typ. (depends on the soldermask

registration tolerance)

Stencil opening 0.250 mm

Stencil thickness 0.100 mm

Table 69. WLCSP25 - 25-ball, 2.133 x 2.070 mm, 0.4 mm pitch wafer level chip scale

package mechanical data (continued)

Symbol

millimeters inches

(1)

Min Typ Max Min Typ Max

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