Datasheet

ManualsBrandsST ManualsEmbedded Processors & ControllersMicrocontroller 32bit 128KB LQFP

DS12556 Rev 2 9/201

STM32H750VB STM32H750IB STM32H750XB List of tables

Table 97. DCMI characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169

Table 98. LTDC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170

Table 99. TIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172

Table 100. Minimum i2c_ker_ck frequency in all I2C modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173

Table 101. I2C analog filter characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173

Table 102. SPI dynamic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174

Table 103. I

S dynamic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177

Table 104. SAI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179

Table 105. MDIO Slave timing parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180

Table 106. Dynamic characteristics: SD / MMC characteristics, VDD=2.7V to 3.6V . . . . . . . . . . . . . 181

Table 107. Dynamic characteristics: eMMC characteristics, VDD=1.71V to 1.9V . . . . . . . . . . . . . . . 182

Table 108. USB OTG_FS electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184

Table 109. Dynamic characteristics: USB ULPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184

Table 110. Dynamics characteristics: Ethernet MAC signals for SMI. . . . . . . . . . . . . . . . . . . . . . . . . 185

Table 111. Dynamics characteristics: Ethernet MAC signals for RMII . . . . . . . . . . . . . . . . . . . . . . . . 186

Table 112. Dynamics characteristics: Ethernet MAC signals for MII . . . . . . . . . . . . . . . . . . . . . . . . . 187

Table 113. Dynamics characteristics: JTAG characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188

Table 114. Dynamics characteristics: SWD characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188

Table 115. LQPF100 - 100-pin, 14 x 14 mm low-profile quad flat package

mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191

Table 116. UFBGA176+25 - ball, 10 x 10 mm, 0.65 mm pitch,

ultra fine pitch ball grid array package mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . 193

Table 117. UFBGA 176+25 recommended PCB design rules (0.65 mm pitch BGA) . . . . . . . . . . . . 194

Table 118. TFBG - 240 +25 ball, 14x14 mm, 0.8 mm pitch, fine pitch ball grid array

mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196

Table 119. TFBGA - 240+25ball recommended PCB design rules (0.8 mm pitch) . . . . . . . . . . . . . . 197

Table 120. Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198

Table 121. STM32H750xB ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199

Table 122. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200

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