Datasheet
DocID030538 Rev 3 225/226
STM32H743xI Revision history
225
9 Revision history
Table 128. Document revision history
Date Revision Changes
22-Jun-2017 1 Initial release.
27-Sep-2017 2
Updated list of features. Changed datasheet status to
“production data”.
Added UFBGA169 and TFBGA100 packages and well as notes
related their status on cover page and in Table 2: STM32H743xI
features and peripheral counts. Differentiated number of GPIOs
for each package in Table 2: STM32H743xI features and
peripheral counts.
Updated Error code correction (ECC) in Section 3.3.2:
Embedded SRAM. Change PWR_CR3 into PWR_D3CR in
Section 3.5.1: Power supply scheme. Updated Section 3.12:
Nested vectored interrupt controller (NVIC).
Added Table 4: DFSDM implementation in Section 3.23: Digital
filter for sigma-delta modulators (DFSDM)
Changed PC2/3 to PC2/3_C and VDD33USB to VDD in
Figure 3: LQFP100 pinout. Changed PC2/3 to PC2/3_C in
Figure 5: LQFP144 pinout. Changed PC2/3 to PC2/3_C in
Figure 7: LQFP176 pinout. Changed PC2/3 to PC2/3_C in
Figure 9: LQFP208 pinout.
Table 8: STM32H743xI pin/ball definition:
– Modified PA7, PC4, PC5, PB1, PG1, PE7, PE8 and PE9 I/O
structure
– TFBGA240 +25: removed duplicate occurrence of F1, F2 and
P17
pin; added notes related to F1, F2, G2 pin connection;
added note on E1, L16, L17, M16, M17, K16, K17, N17.
– UFBGA176+25: changed G10 pin name to VSS.
– Added note to VREF+ pin.
Added current consumption corresponding to 125 °C ambient
te
mperature in Section 6.3.6: Supply current characteristics.
Removed CRYP peripheral from Table 38: Peripheral current
consumption in Run mode.
Replaced FMC_CLK by FMC_SDCLK in Section : SDRAM
waveforms and timings.
Updated t
LATRINJ
in Table 84: ADC characteristics.
For TFBGA100, TFBGA240+25 and UFBGA169, updated
thermal resistance power-junction in Table 126: Thermal
characteristics as well as power dissipation in Table 23: General
operating conditions.
23-Oct-2017 3
Features:
– Removed secure firmware upgrade support.
– Total current consumption changed to 4
µA minimum
.
Updated F
igure 6: UFBGA169 ballout.
Updated dpad and dsm in Table 125: TFBGA240+25, 265 pin
recommended PCB design rules (0.8 mm pitch).
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