Datasheet

Contents STM32F765xx STM32F767xx STM32F768Ax STM32F769xx
6/255 DocID029041 Rev 6
5.3.27 Reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171
5.3.28 DAC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172
5.3.29 Communications interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174
5.3.30 FMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191
5.3.31 Quad-SPI interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 211
5.3.32 Camera interface (DCMI) timing specifications . . . . . . . . . . . . . . . . . . 213
5.3.33 LCD-TFT controller (LTDC) characteristics . . . . . . . . . . . . . . . . . . . . . 214
5.3.34 Digital filter for Sigma-Delta Modulators (DFSDM) characteristics . . . 216
5.3.35 DFSDM timing diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218
5.3.36 SD/SDIO MMC card host interface (SDMMC) characteristics . . . . . . . 219
6 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221
6.1 LQFP100 14x 14 mm, low-profile quad flat package information . . . . . . 221
6.2 TFBGA100, 8 x 8 x 0.8 mm thin fine-pitch ball grid array
package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225
6.3 LQFP144 20 x 20 mm, low-profile quad flat package information . . . . . 228
6.4 LQFP176 24 x 24 mm, low-profile quad flat package information . . . . . 232
6.5 LQFP208 28 x 28 mm low-profile quad flat package information . . . . . . 236
6.6 WLCSP 180-bump, 5.5 x 6 mm, wafer level chip scale
package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240
6.7 UFBGA176+25, 10 x 10, 0.65 mm ultra thin fine-pitch ball grid
array package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 244
6.8 TFBGA216, 13 x 13 x 0.8 mm thin fine-pitch ball grid
array package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 247
6.9 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250
7 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 251
Appendix A Recommendations when using internal reset OFF . . . . . . . . . . . 252
A.1 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 253
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