Datasheet
Package information STM32F765xx STM32F767xx STM32F768Ax STM32F769xx
242/255 DocID029041 Rev 6
Figure 100. WLCSP 180-bump, 5.5 x 6 mm, 0.4 mm pitch wafer level chip scale
package recommended footprint
1. Dimensions are expressed in millimeters.
Table 133. WLCSP 180-bump, 5.5 x 6 mm, recommended PCB design rules
(0.4 mm pitch)
Dimension Recommended values
Pitch 0.4
Dpad 0.225 mm
Dsm
0.290 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening 0.250 mm
Stencil thickness 0.1 mm
'SDG
'VP
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