Datasheet
Description STM32F745xx STM32F746xx
14/227 DocID027590 Rev 4
Communication
interfaces
SPI / I
2
S 4/3 (simplex)
(2)
6/3 (simplex)
(2)
I
2
C 4
USART/
UART
4/4
USB OTG
FS
Yes
USB OTG
HS
Yes
CAN 2
SAI 2
SPDIFRX 4 inputs
SDMMC Yes
Camera interface Yes
LCD-TFT No Yes No Yes No Yes No Yes No Yes
Chrom-ART Accelerator™
(DMA2D)
Yes
GPIOs 82 114 140 168
12-bit ADC
Number of channels
3
16 24
12-bit DAC
Number of channels
Yes
2
Maximum CPU frequency 216 MHz
(3)
Operating voltage 1.7 to 3.6 V
(4)
Operating temperatures
Ambient temperatures: –40 to +85 °C /–40 to +105 °C
Junction temperature: –40 to + 125 °C
Package
LQFP100
TFBGA100
WLCSP143
LQFP144
UFBGA176
LQFP176
LQFP208 TFBGA216
1. For the LQFP100 package, only FMC Bank1 is available. Bank1 can only support a multiplexed NOR/PSRAM memory using the NE1 Chip Select.
2. The SPI1, SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the I2S audio mode.
3. 216 MHz maximum frequency for -40°C to + 85°C ambient temperature range (200 MHz maximum frequency for -40°C to + 105°C ambient temperature range).
4. VDD/VDDA minimum value of 1.7 V is obtained when the internal reset is OFF (refer to Section 2.17.2: Internal reset OFF).
Table 2. STM32F745xx and STM32F746xx features and peripheral counts (continued)
Peripherals STM32F745Vx STM32F746Vx STM32F745Zx STM32F746Zx STM32F745Ix STM32F746Ix STM32F745Bx STM32F746Bx STM32F745Nx STM32F746Nx
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