Datasheet

DocID028479 Rev 1 5/121
STM32F722xx STM32F723xx Contents
5
5.6 UFBGA 176+25, 10 x 10, 0.65 mm ultra thin-pitch ball grid
array package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .112
5.7 WLCSP100 - 0.4 mm pitch wafer level chip scale package information .114
5.8 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .117
6 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
Appendix A Recommendations when using internal reset OFF . . . . . . . . . . . 119
A.1 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .119
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
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