Datasheet

Package information STM32F722xx STM32F723xx
116/121 DocID028479 Rev 1
Figure 38. WLCSP100 – 100L, 4.166 x 4.628 mm 0.4 mm pitch wafer level chip scale
package recommended footprint
Table 23. WLCSP100 recommended PCB design rules (0.4 mm pitch)
Dimension Recommended values
Pitch 0.4 mm
Dpad 0.225 mm
Dsm 0.290 mm
Stencil thickness 0.1 mm
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