Datasheet

DocID028479 Rev 1 113/121
STM32F722xx STM32F723xx Package information
117
Figure 36. UFBGA176+25, 10 x 10 mm x 0.65 mm, ultra fine-pitch ball grid array
package recommended footprint
Table 21. UFBGA176+25 recommended PCB design rules (0.65 mm pitch BGA)
Dimension Recommended values
Pitch 0.65 mm
Dpad 0.300 mm
Dsm
0.400 mm typ. (depends on the soldermask reg-
istration tolerance)
Stencil opening 0.300 mm
Stencil thickness Between 0.100 mm and 0.125 mm
Pad trace width 0.100 mm
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