Datasheet

STM32F427xx STM32F429xx Description
DocID024030 Rev 10 17/239
12-bit DAC Number of channels
Yes
2
Maximum CPU frequency 180 MHz Operating voltage 1.8 to 3.6 V
(3)
Operating temperatures
Ambient temperatures: –40 to +85 °C /–40 to +105 °C
Junction temperature: –40 to + 125 °C
Packages LQFP100
WLCSP143
LQFP144
UFBGA169
UFBGA176
LQFP176
LQFP208 TFBGA216
1. For the LQFP100 package, only FMC Bank1 or Bank2 are available. Bank1 can only support a multiplexed NOR/PSRAM memory using the NE1 Chip Select. Bank2 can only support a 16- or 8-bit
NAND Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is not available in this package. For UFBGA169 package, only SDRAM, NAND and multiplexed
static memories are supported.
2. The SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the I2S audio mode. 3. V
DD
/V
DDA
minimum value of 1.7 V is obtained when the device operates in reduced temperature range, and with the use of an external power supply supervisor (refer to Section 3.17.2: Internal reset
OFF).
Table 2. STM32F427xx and STM32F429xx features and peripheral counts (continued)
Peripherals
STM32F427
Vx
STM32F429Vx
STM32F427
Zx
STM32F429Zx
STM32F427
Ax
STM32F429
Ax
STM32F427
Ix
STM32F429Ix STM32F429Bx STM32F429Nx
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