Datasheet
Revision history STM32F427xx STM32F429xx
236/239 DocID024030 Rev 10
19-Feb-2015 5
Update SPI/IS2 in Table 2: STM32F427xx and STM32F429xx features
and peripheral counts.
Updated LQFP208 in Table 4: Regulator ON/OFF and internal reset
ON/OFF availability.
Updated Figure 19: Memory map.
Changed PLS[2:0]=101 (falling edge) maximum value in Ta ble 22 :
reset and power control block characteristics.
Updated current consumption with all peripherals disabled in Table 24:
Typical and maximum current consumption in Run mode, code with
data processing running from Flash memory (ART accelerator
enabled except prefetch) or RAM. Updated note 1. in Table 28: Typical
and maximum current consumptions in Standby mode.
Updated t
WUSTOP
in Table 36: Low-power mode wakeup timings.
Updated ESD standards and Table 53: ESD absolute maximum
ratings.
Updated Table 56: I/O static characteristics.
Section : I2C interface characteristics: updated section introduction,
removed Table I2C characteristics, Figure I2C bus AC waveforms and
measurement circuit and Table SCL frequency; added Table 61: I2C
analog filter characteristics.
Updated measurement conditions in Table 62: SPI dynamic
characteristics.
Updated Figure 51: Typical connection diagram using the ADC.
Updated Section : Device marking for LQFP100.
Updated Figure 83: WLCSP143 - 143-ball, 4.521x 5.547 mm, 0.4 mm
pitch wafer level chip scale package outline and Table 111: WLCSP143
- 143-ball, 4.521x 5.547 mm, 0.4 mm pitch wafer level chip scale
package mechanical data; added Figure 84: WLCSP143 - 143-ball,
4.521x 5.547 mm, 0.4 mm pitch wafer level chip scale recommended
footprint and Table 112: WLCSP143 recommended PCB design rules
(0.4 mm pitch). Updated Figure 85: WLCSP143 marking example
(package top view) and related note. Updated Section : Device
marking for WLCSP143.
Updated Section : Device marking for LQFP144.
Updated Section : Device marking for LQFP176.
Updated Figure 92: LQFP208 - 208-pin, 28 x 28 mm low-profile quad
flat package outline; Updated Section : Device marking for LQFP208.
Modified UFBGA169 pitch, updated Figure 95: UFBGA169 - 169-ball 7
x 7 mm 0.50 mm pitch, ultra fine pitch ball grid array package outline
and Table 116: UFBGA169 - 169-ball 7 x 7 mm 0.50 mm pitch, ultra
fine pitch ball grid array package mechanical data; updated Section :
Device marking for LQFP208.
updated Section : Device marking for UFBGA169, Section : Device
marking for UFBGA176+25 and Section : Device marking for
TFBGA176.
Updated Z pin count in Table 122: Ordering information scheme.
Table 124. Document revision history
Date Revision Changes
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