Datasheet

Description STM32F415xx, STM32F417xx
16/206 DocID022063 Rev 8
GPIOs 51 72 82 114 82 114 140 12-bit ADC Number of channels
3
16 13 16 24 16 24 24
12-bit DAC Number of channels
Yes
2
Maximum CPU frequency 168 MHz Operating voltage 1.8 to 3.6 V
(3)
Operating temperatures
Ambient temperatures: –40 to +85 °C /–40 to +105 °C
Junction temperature: –40 to + 125 °C
Package LQFP64 WLCSP90 LQFP100 LQFP144 LQFP100 LQFP144
UFBGA176
LQFP176
1. For the LQFP100 and WLCSP90 packages, only FSMC Bank1 or Bank2 are available. Bank1 can only support a multiplexed NOR/PSRAM memory using the NE1 Chip
Select. Bank2 can only support a 16- or 8-bit NAND Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is not available in this package.
2. The SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the I2S audio mode. 3. V
DD
/V
DDA
minimum value of 1.7 V is obtained when the device operates in reduced temperature range, and with the use of an external power supply supervisor (refer to
Section : Internal reset OFF).
Table 2. STM32F415xx and STM32F417xx: features and peripheral counts
Peripherals STM32F415RG STM32F415OG STM32F415VG STM32F415ZG STM32F417Vx STM32F417Zx STM32F417Ix
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