Datasheet
DocID029162 Rev 6 175/208
STM32F413xG/H Package information
205
7 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at:
www.st.com.
ECOPACK
®
is an ST trademark.
7.1 WLCSP81 package information
Figure 63. WLCSP81 - 81-ball, 4.039 x 3.951 mm, 0.4 mm pitch wafer level chip scale
package outline
1. Drawing is not to scale.
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