Datasheet
Package information STM32F412xE/G
162/193 DocID028087 Rev 4
7 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
7.1 WLCSP64 package information
Figure 60. WLCSP64 - 64-pin, 3.658 x 3.686 mm, 0.4 mm pitch wafer level chip scale
package outline
1. Drawing is not to scale.
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