Datasheet

DocID026289 Rev 6 9/149
STM32F411xC STM32F411xE List of figures
9
chip scale package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
Figure 47. WLCSP49 - 49-ball, 2.999 x 3.185 mm, 0.4 mm pitch wafer level chip scale
recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
Figure 48. WLCSP49 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
Figure 49. UFQFPN48 - 48-lead, 7 x 7 mm, 0.5 mm pitch, ultra thin fine pitch
quad flat package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
Figure 50. UFQFPN48 - 48-lead, 7 x 7 mm, 0.5 mm pitch, ultra thin fine pitch
quad flat recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
Figure 51. UFQFPN48 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
Figure 52. LQFP64 - 64-pin, 10 x 10 mm, 64-pin low-profile quad flat package outline . . . . . . . . . . 130
Figure 53. LQFP64 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
Figure 54. LQFP64 marking example (package top view). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
Figure 55. LQFP100 - 100-pin, 14 x 14 mm, 100-pin low-profile quad flat
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
Figure 56. LQFP100 - 100-pin, 14 x 14 mm, 100-pin low-profile quad flat
recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
Figure 57. LQPF100 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
Figure 58. UFBGA100 - 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch
ball grid array package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
Figure 59. Recommended PCB design rules for pads (0.5 mm-pitch BGA) . . . . . . . . . . . . . . . . . . . 138
Figure 60. UFBGA100 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139
Figure 61. USB controller configured as peripheral-only and used in Full-Speed mode . . . . . . . . . . 143
Figure 62. USB controller configured as host-only and used in Full-Speed mode. . . . . . . . . . . . . . . 143
Figure 63. USB controller configured in dual mode and used in Full-Speed mode . . . . . . . . . . . . . . 144
Figure 64. Sensor Hub application example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
Figure 65. Batch Acquisition Mode (BAM) example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146
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