Datasheet

Description STM32F405xx, STM32F407xx
15/202 DocID022152 Rev 8
Communi cation interfaces
SPI / I2S 3/2 (full duplex)
(2)
I
2
C 3
USART/ UART
4/2
USB OTG FS
Yes
USB OTG HS
Yes
CAN 2 SDIO Yes
Camera interface No Ye s GPIOs 51 72 82 114 72 82 114 140 12-bit ADC Number of channels
3
16 13 16 24 13 16 24 24
12-bit DAC Number of channels
Yes
2
Maximum CPU frequency
168 MHz
Operating voltage 1.8 to 3.6 V
(3)
Operating temperatures
Ambient temperatures: –40 to +85 °C /–40 to +105 °C
Junction temperature: –40 to + 125 °C
Package LQFP64 WLCSP90 LQFP100 LQFP144 WLCSP90 LQFP100 LQFP144
UFBGA176
LQFP176
1. For the LQFP100 and WLCSP90 packages, only FSMC Bank1 or Bank2 are available. Bank1 can only support a multiplexed NOR/PSRAM memory using the NE1 Chip
Select. Bank2 can only support a 16- or 8-bit NAND Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is not available in this package.
2. The SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the I
2
S audio mode.
3. V
DD
/V
DDA
minimum value of 1.7 V is obtained when the device operates in reduced temperature range, and with the use of an external power supply supervisor (refer to
Section : Internal reset OFF).
Table 2. STM32F405xx and STM32F407xx: features and peripheral counts (continued)
Peripherals STM32F405RG STM32F405OG STM32F405VG STM32F405ZG STM32F405OE STM32F407Vx STM32F407Zx STM32F407Ix
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