Datasheet

STM32F405xx, STM32F407xx Electrical characteristics
Doc ID 022152 Rev 2 83/167
5.3.7 Wakeup time from low-power mode
The wakeup times given in Table 2 5 is measured on a wakeup phase with a 16 MHz HSI RC
oscillator. The clock source used to wake up the device depends from the current operating
mode:
● Stop or Standby mode: the clock source is the RC oscillator
● Sleep mode: the clock source is the clock that was set before entering Sleep mode.
All timings are derived from tests performed under ambient temperature and V
DD
supply
voltage conditions summarized in Table 11.
APB2
SDIO 0.64 0.54
mA
TIM1 1.47 1.14
TIM8 1.58 1.22
TIM9 0.68 0.54
TIM10 0.45 0.36
TIM11 0.47 0.38
ADC1
(5)
2.20 2.10
ADC2
(5)
2.04 1.93
ADC3
(5)
2.10 2.00
SPI1 0.14 0.12
USART1 0.34 0.27
USART6 0.34 0.28
1. HSE oscillator with 4 MHz crysta) and PLL are on.
2. I2SMOD bit set in SPI_I2SCFGR register, and then the I2SE bit set to enable I2S peripheral.
3. EN1 bit is set in DAC_CR register.
4. EN2 bit is set in DAC_CR register.
5. ADON bit set in ADC_CR2 register.
Table 24. Peripheral current consumption (continued)
Peripheral
(1)
168 MHz 144 MHz Unit
Table 25. Low-power mode wakeup timings
Symbol Parameter
Min
(1)
Typ
(1)
Max
(1)
Unit
t
WUSLEEP
(2)
Wakeup from Sleep mode - 1 - µs
t
WUSTOP
(2)
Wakeup from Stop mode (regulator in Run mode) - 13 -
µs
Wakeup from Stop mode (regulator in low power mode) - 17 40
Wakeup from Stop mode (regulator in low power mode
and Flash memory in Deep power down mode)
-110-
t
WUSTDBY
(2)(3)
Wakeup from Standby mode 260 375 480 µs
1. Based on characterization, not tested in production.
2. The wakeup times are measured from the wakeup event to the point in which the application code reads the first instruction.
3. t
WUSTDBY
minimum and maximum values are given at 105 °C and –45 °C, respectively.