Datasheet

Package characteristics STM32F405xx, STM32F407xx
150/167 Doc ID 022152 Rev 2
Figure 78. UFBGA176+25 - ultra thin fine pitch ball grid array 10 × 10 × 0.6 mm, package outline
1. Drawing is not to scale.
Seating plane
C
A2
A4
A3
Cddd
A1
A
A
B
e
F
D
F
E
e
R
eee
M
CAB
Cfff
(176 balls)Øb
M
Ø
Ø
A0E7_ME
Ball A1
A
15 1
Table 89. UFBGA176+25 - ultra thin fine pitch ball grid array 10 × 10 × 0.6 mm mechanical data
Symbol
millimeters inches
(1)
Min Typ Max Min Typ Max
A 0.460 0.530 0.600 0.0181 0.0209 0.0236
A1 0.050 0.080 0.110 0.002 0.0031 0.0043
A2 0.400 0.450 0.500 0.0157 0.0177 0.0197
A3 0.130 0.0051
A4 0.270 0.320 0.370 0.0106 0.0126 0.0146
b 0.230 0.280 0.330 0.0091 0.0110 0.0130
D 9.950 10.000 10.050 0.3740 0.3937 0.3957
E 9.950 10.000 10.050 0.3740 0.3937 0.3957
e 0.600 0.650 0.700 0.0236 0.0256 0.0276
F 0.400 0.450 0.500 0.0157 0.0177 0.0197
ddd 0.080 0.0031
eee 0.150 0.0059
fff 0.080 0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.