Datasheet

List of figures STM32F401xD STM32F401xE
8/135 DocID025644 Rev 3
Figure 47. WLCSP49 0.4 mm pitch wafer level chip size recommended footprint . . . . . . . . . . . . . . 117
Figure 48. Example of WLCSP49 marking (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
Figure 49. UFQFPN48, 7 x 7 mm, 0.5 mm pitch, package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . 119
Figure 50. UFQFPN48 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
Figure 51. Example of UFQFPN48 marking (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
Figure 52. LQFP64, 10 x 10 mm, 64-pin low-profile quad flat package outline . . . . . . . . . . . . . . . . . 122
Figure 53. LQFP64 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
Figure 54. Example of LQFP64 marking (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
Figure 55. LQFP100, 14 x 14 mm, 100-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 125
Figure 56. LQFP100 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
Figure 57. Example of LQPF100 marking (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
Figure 58. UFBGA100, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
Figure 59. Recommended PCB design rules for pads (0.5 mm-pitch BGA) . . . . . . . . . . . . . . . . . . . 129
Figure 60. Example of UFBGA100 marking (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
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